TDM LARGE SCALE平面度/平坦度/平整度/翹曲度測試儀

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產品簡介

TDM–LS(LAGERSCALE)平面度/平坦度/平整度/翹曲度測試儀/warpageanalysis:TheTDM–LS(LAGERSCALE)isaversatileinstrumentforawidearrayofapplicationsintheareasofprocessdevelopment

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TDM–LS(LAGER SCALE)平面度/平坦度/平整度/翹曲度測試儀/warpage analysis:

The TDM–LS(LAGER SCALE) is a versatile instrument for a wide array of applications in the areas of process development, failure analysis, reliability, and quality control. In order to present a complete product solution to the existing demａnd for warpage measurements, the TDM Large Scale complements the TDM Compact. The first generation of TDM was designed for surface analysis of relatively small area (up to 150x150 mm) while the TDM Large Scale offers surface inspection of areas up to 400x400 mm. Therefore the thermo-mechanical analysis of boards, wafers, and other large object becomes possible

ABSOLUTE 3D CARTOGRAPHY

TDM is a patented tool for warpage analysis under a temperature profile. TDM uses the fringe projection technology (also called projection moiré) for non-contact, full-field acquisition of 3D topographies with a resolution as low as 1.5 µm. TDM-Compact acquires a full, absolute 3D cartography of devices with dimensions up to 600 mm x 430 mm. Simultaneously, its powerful heating and cooling capabilities allow for virtually any temperature profile on the sample under test. The integrated software package provides tools for representation of the results as 3D plots, vectors diagrams, isometrics views, and 2D profiles following user-defined profile lines (e.g., diagonal plots).

LARGE SAMPLE SIZE CAPABILITY :

Component qualification for reflow profile compatibility.

Component curing process optimization.

Component and PCB characterization following JEITA-ED-7306 IPC-9641 JEDEC 22B112A and IPC/JEDEC J-STD-020D standards.

Fast aging test profiles, ON/OFF cycles, etc.

LARGE SCALE ADVANTAGES:

Independently controlled top/bottom heater banks for superior temperature uniformity.

Fast heating and cooling ramp.

Ultra high resolution camera for fine feature analysis (e.g., measurement of solder balls/bumps, leads, pins, etc.) and more accurate warpage measurements.

Sample drawer for easy sample loading.

型號	TDM LARGE SCALE

Imaging :	Direct sample illumination, non-contact measurement
Capabilities :	Topography analysis: z(x,y) function of the temperature
Maximum samples size :	600 mm x 430 mm
Oven size :	400 mmx 400 mm
Field of view (x,y) :	Adjustable Zoom from 30 x 30 to 400 x 400 mm
Depth of view (z) :	Up to 25 mm
CCD camera resolution :	5 megapixel
Accuracy :	+/-1 micron or 2% of measured value, whichever is greater
(x,y) resolution :	15 μm to 200 μm depending on the FOV
Temperature range :	Room temperature to 300° C continuous
Heating method :	IR lamps - top and bottom
Heating rate :	Up to +2.5° C/s (sample dependent)
Cooling method :	Internal ventilation
Cooling rate :	Up to -2° C/s above 120° C
Footprint :	200 cm x 150 cm x 250 cm
Weight approx :	500 kg
Utilities :	Electricity: Electricity: 380 VAC, 50 Hz, 3 phases, Fumes extraction 2000m3/h.